System for Manufacturing Electrosurgical Seal Plates

ABSTRACT

A system for the manufacture of an end effector assembly which is configured for use with an electrosurgical instrument configured for performing an electrosurgical procedure is provided. The system includes a photolithography module that is configured to etch one or more pockets on a seal surface of the seal plate. A vacuum module is configured to raise, transfer and lower a spacer from a location remote from the pocket(s) on the seal plate to the pocket on the seal plate(s). An adhesive dispensing module is configured to dispense an adhesive into the pocket on the seal plate. An optical module is configured to monitor a volume of the adhesive dispensed within the pocket and monitor placement of the spacer within the pocket.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a Divisional Application which claims thebenefit of and priority to U.S. patent application Ser. No. 12/568,282,filed on Sep. 28, 2009, the entire contents of which being incorporatedherein by reference in its entirety.

BACKGROUND

1. Technical Field

The present disclosure relates to a method and system for manufacturingelectrosurgical seal plates and, more particularly, to a method andsystem that employs photolithographic processes and systems operativelyassociated therewith to manufacture seal plates.

2. Background of Related Art

Electrosurgical forceps, e.g., bipolar or monopolar forceps, arecommonly known in the medical art. Typically, the electrosurgicalforceps are configured to, amongst other things, grasp and subsequentlyseal tissue. With this purpose in mind, the electrosurgical forceps,typically, include a pair of movable jaw members each having arespective seal plate operatively disposed thereon.

Typically, the seal plates disposed on the jaw members are configured totransfer electrosurgical energy having one or more frequencies to tissueto electrosurgically treat the tissue (e.g., seal tissue) and, inconjunction with a cutting element (e.g., knife blade), subsequentlysever the sealed tissue. In certain instances, the seal plates may beconfigured to maintain a certain gap distance between the seal plateswhen the jaw members are in a closed position and tissue is graspedtherebetween. As can be appreciated by one skilled in the art, the sealplates may be configured to perform and/or provide additional functionsnot described herein.

To provide the seal plates with the capability to seal, subsequentlysever, and/or maintain a desired gap distance, the seal platesfrequently are designed to include one or more features operativelydisposed thereon or formed therewith. For example, in the instance wherethe seal plates are configured to subsequently sever tissue, one or bothof the seal plates may include a knife slot configured to receive aknife blade. In the instance where the seal plates are configured tomaintain a desired gap distance, one or both of the seal plates mayinclude one or more stop members. In either instance, forming the sealplates during the manufacture process requires extremely highprecession, which may lead to high tolerance stack-ups (e.g., knifeblade to knife slot width ratios). Additionally, conventional means forpositioning a stop member on a seal plate include bonding the stopmember to a seal surface of the seal plate. In this instance, however,the bond and/or stop member that secures the stop member to the sealsurface of the seal plate is susceptible to shear stresses associatedwith opening and closing the jaw members of an end effector assembly.

Conventional manufacture processes for seal plates may include stamping,punching, blanking, embossing, bending, flanging, coining, etc. In someinstances, however, these manufacturing process may not be suitable forunique and/or complex jaw member and/or seal plate geometries, such as,for example, when one or both of the seal plates requires a knife slotor stop member formed thereon. Additionally, manufacture of the sealplates via the aforementioned process, in certain instances, may not becost effective.

SUMMARY

The present disclosure provides a method of manufacture for an endeffector assembly configured for use with an electrosurgical instrumentconfigured for performing an electrosurgical procedure. The methodincludes providing a pair of jaw members. A step of the method includesforming one or more seal plates positionable on one of the pair of jawmembers. Etching a dam along a side of the one or more seal plates is astep of the method, wherein the etched dam inhibits the flow of aplastic on the one or more seal plate such that a height of the plasticwith respect to the at least one seal plate during an overmoldingprocess may be controlled. The method includes positioning the one ormore seal plates on the one of the pair of jaw members; and overmoldingthe seal plate to one or more of the pair of jaw members.

The present disclosure provides a method of manufacture for an endeffector assembly configured for use with an electrosurgical instrumentconfigured for performing an electrosurgical procedure. The methodincludes providing a pair of jaw members. A step of the method includesforming one or more seal plates positionable on one or more of a pair ofjaw members associated with the end effector assembly. Etching a damalong a side of the one or more seal plates is a step of the method,wherein the etched dam inhibits the flow of a plastic on the one or moreseal plates such that a height of the plastic with respect to the one ormore seal plates during an overmolding process may be controlled.Etching a targeted retention feature along the side of the one or moreseal plates is another step of the method. Etching one or more pocketson a seal surface of the one or more seal plates is yet another step ofthe method. The method includes depositing an adhesive into the one ormore pockets on the one or more seal plates. A step of the methodincludes transferring a spacer from a location remote from the one ormore pockets on the one or more seal plates to the one or more pocketson the at least one seal plate. Curing the adhesive and positioning theone or more seal plates on one of the pair of jaw members are steps ofthe method. Overmolding the seal plate to jaw member is still anotherstep of the method.

The present disclosure also provides a system for the manufacture of anend effector assembly configured for use with an electrosurgicalinstrument configured for performing an electrosurgical procedure. Thesystem includes a photolithography module configured to etch one or morepockets on a seal surface of the seal plate. The system includes avacuum module configured to raise, transfer and lower a spacer from alocation remote from the one or more pockets on the seal plate to theone or more pockets on the seal plate. The system includes an adhesivedispensing module configured to dispense an adhesive into the one ormore pockets on the seal plate and allowing the adhesive to cure. Thesystem may include an optical module configured to monitor a volume ofadhesive dispensed within the one or more pockets and monitor placementof the spacer within the one or more pockets.

In an embodiment, the adhesive dispensing module includes a module toheat cure the adhesive after the spacer has been positioned within theat least one pocket.

In an embodiment, a retention feature is etched on the at least one sealplate and is configured to secure the at least one seal plate to atleast one of a pair of jaw members of the end effector assembly.

In an embodiment, a knife slot is etched on the at least one seal plateand is configured to receive a knife blade of the electrosurgicalinstrument.

In an embodiment, one or both of the seal plate includes two or morematerials laminated together, wherein the two or more materials iselectrically conductive. In one particular embodiment, the two or morematerials is selected from the group consisting of stainless steel,copper and ceramic. The copper may include etched heat sinks formed atpredetermined locations on the at least one seal plate.

In an embodiment, the one or more seal plate includes a polyimide flexcircuit, wherein the polyimide flex circuit is configured to provideelectrical communication between the at least one seal plate and asource of electrosurgical energy. In one particular embodiment, thepolyimide flex circuit includes a dialectic material having one or moreetched through holes configured to create an electrical interconnectionbetween the at least seal plate and the source of electrosurgicalenergy.

In an embodiment, one or both of the seal plates includes a texturedsurface, logo, and/or ruler etched thereon.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments of the present disclosure are described hereinbelowwith references to the drawings, wherein:

FIG. 1 is a flowchart illustrating steps for manufacturing a seal platein accordance with an embodiment of the present disclosure;

FIG. 2 is a side, perspective view of a seal plate according to anembodiment of the present disclosure and formed via the method of FIG.1;

FIGS. 3A and 3B are perspective views of a seal plate according to analternate embodiment of the present disclosure and formed via the methodof FIG. 1;

FIG. 4 is a perspective view of a seal plate according to an alternateembodiment of the present disclosure and formed via the method of FIG.1;

FIGS. 5A and 5B are respective cross-sectional views of a seal plateshown in a pre-formed and formed condition according to an alternateembodiment of the present disclosure and formed via the method of FIG.1;

FIG. 6 is a perspective view of the seal plate of FIGS. 5A and 5B;

FIG. 7 is a perspective view of a seal plate according to an alternateembodiment of the present disclosure and formed via the method of FIG.1;

FIG. 8 is a cross-sectional view of a laminated seal plate according toan alternate embodiment of the present disclosure and formed via themethod of FIG. 1;

FIGS. 9A-9C is a seal plate including one or more points of electricalcontact according to an alternate embodiment of the present disclosureand formed via the method of FIG. 1;

FIG. 10 is an area of detail of the seal plate illustrated in FIG. 1;

FIGS. 11A-11F are various configurations of spacers adapted for use witha seal plate formed via the method of FIG. 1;

FIG. 12 illustrates a block diagram of a system adapted for use with themethod of FIG. 1 and configured to position one of the various spacersdepicted in FIGS. 11A-11F within a seal plate formed via the method ofFIG. 1; and

FIGS. 13A and 13B are functional block diagrams of a method of use ofthe system of FIG. 12.

DETAILED DESCRIPTION

Embodiments of the presently disclosed method and system are describedin detail with reference to the drawing figures wherein like referencenumerals identify similar or identical elements. As used herein, theterm “distal” refers to that portion which is further from the userwhile the term “proximal” refers to that portion which is closer to theuser.

The method and system of the present disclosure implementsphotolithographic processes in combination with etching processes tocreate specific, unique, complex geometries and/or features for sealplates used in the design of electrosurgical instruments, such as, forexample, bipolar and monopolar electrosurgical devices. For example,possible features may include knife blade slots, recessed features, finedelicate features, and half etched features; all of which to bediscussed in greater detail below. In addition to creating theaforementioned features, the precision of etching allows for greatlyreduced tolerance stack-ups which could reduce issues with, for example,knife blade to knife slot ratios. Moreover, because the seal plates ofthe present disclosure are formed via suitable photolithographic andetching processes, the seal plates may be processed in lead frames thatmay be used in automated processes, which reduces costs associated withthe aforementioned conventional manufacturing processes (e.g.,stamping). Further, etch recipes associated with a given etch process,allow a user to enter practical data relating to the seal plate that mayfacilitate forming the seal plate during the etch process. For example,etch recipes associated with a given etch process may be tuned to haveboth vertical and non-vertical profiles, such as, when forming a knifeslot on the seal plate.

With reference to FIG. 1, a flowchart illustrating a method ofmanufacture for an end effector assembly that includes a pair of jawmembers each including a seal plate disposed thereon and configured foruse with an electrosurgical instrument, e.g., electrosurgical forceps,in accordance with an embodiment of the present disclosure is showndesignated 200.

An initial step of the method 200 includes providing a pair of jawmembers (step 202) associated with an end effector adapted to connect toan electrosurgical forceps, such as, for example, a bipolar forceps. Thejaw members may be formed by any suitable means, e.g., molding, casting,stamping, etc.

So as not to obscure the following disclosure with redundantinformation, manufacture of the seal plate is described herein as asingle seal plate formed from a single sheet of material. Those skilledin the art will appreciate that a plurality of seal plates may bemanufactured from a single sheet of material.

A step of method 200 includes forming a seal plate 102 (see step 204, inFIG. 1). Seal plate 102 may be formed from any suitable material, suchas, for example, from a sheet of metal. A seal plate 102 formedaccording to method 200 is shown in FIG. 2. During formation of sealplate 102, seal plate 102 may be fully or partially etched (see step206, in FIG. 1). For example, seal plate 102 may be etched to includeone or more types of retention features 106. In the embodimentillustrated in FIG. 2, retention features 106 include a plurality etchedflanges 110 that extend along one of a pair of sides 108 of the sealplate 102. In embodiments, retention features 106 may be partiallyetched in and/or fully etched through the seal plate 102. An example ofpartially etched retention features 106 is illustrated in FIG. 3A. Moreparticularly, the partially etched retention features may be partiallyetched slots 112, partially etched cavities 114, and/or partially etchedcurved channels 116. An example of fully etched retention features 106is illustrated in FIG. 3B. More particularly, the fully etched retentionfeatures 106 may be fully etched apertures 118. In either of theembodiments illustrated in FIGS. 2-3B, retention features 106 may beconfigured to securely retain the seal plate 102 to a respective jawmember of an end effector assembly associated with an electrosurgicalforceps.

A step of method 200 includes positioning the seal plate 102 on arespective jaw member and subsequently overmolding the seal plate 102 toa respective jaw member (see steps 208 and 210 respectively in FIG. 1).In an embodiment, the photolithographic and etch processes in accordancewith the method 200 of the present disclosure may be implemented tocreate partial etch dams along a side 108 of the seal plate 102. Moreparticularly, one or more partial etch dams 116 may be disposed and/orformed along one of the sides 108 of seal plate 102, see FIG. 4. Partialetch dam 116 is configured to control the height of an overmold duringthe overmolding process of the seal plate 102 to a respective jaw memberof the end effector assembly. More particularly, the partial dam 116 isconfigured to inhibit the flow of a plastic during the overmoldingprocess ensuring that the height of the plastic does not exceed apredetermined height on the seal plate 102 and/or the respective jawmember. Controlling and/or preventing the height of the plastic fromexceeding a predetermined height on the seal plate 102 and/or arespective jaw member, e.g., jaw member 110 or 120, during theovermolding process, minimizes or “tightens” distribution of thermalspread during an electrosurgical procedure, e.g., electrosurgicalsealing procedure. More particularly, the partial etch dam 116 creates aseal plate 102 having a consistent height across a length of the sealplate 102, which, in turn, provides a consistent seal across tissue andminimizes thermal spread to adjacent tissue. Experimentation on urethanecoating processes confirms a relationship between seal plates havingconsistent (or inconsistent) seal plate heights and thermal spread. Moreparticularly, thermal spread as a result of seal plates havingconsistent heights across a length of the seal plate was negligible whencompared to seal plates having inconsistent heights across a length ofthe seal plate.

In an embodiment, the photolithographic and etching processes inaccordance with the method 200 of the present disclosure may be employedto create one or more textured patterns on the seal plate 102. Moreparticularly, one type of textured pattern may include, for example, atextured pattern 134 having a plurality of raised dots with varyingdimensions etched on a portion of a seal surface 102 a of the seal plate102, see FIGS. 2 and 10.

With reference to FIGS. 5A and 5B, seal plate 102 is illustratedpre-formed and formed, respectively. In an embodiment, thephotolithographic and etching processes in accordance with the method200 of the present disclosure may be implemented to facilitate formingof the seal plate 102. More particularly, selectively and/or partiallyetching the seal plate 102 lightens the overall structure of the sealplate 102, which, in turn, facilitates bending of the seal plate 102during the forming process. To this end, one or more areas of the sealplate 102 may be selectively and/or partially etched. More particularly,selectively and/or partially etched areas 118 of the seal plate 102 maybe located at predetermined locations on the seal plate 102, see FIGS.5A and 6. Additionally, partial etching may be implemented to createcurves 120 with small, tight radii, see FIGS. 5B and 7, which also makesforming seal plate 102 easier.

With reference again to FIG. 2, in an embodiment, the photolithographicand etching processes in accordance with the method 200 of the presentdisclosure may be implemented to create a knife slot 104 on the sealplate 102. More particularly, a knife slot 104 may be fully etchedthrough the seal plate 102. The high precision that is associated withknown photolithographic and etching processes, allows a manufacturer toform a fully etched knife slot 104 with various geometries. Moreparticularly, in embodiments, the fully etched knife slot 104 may bedefined by a pair of inner facing walls 104 a and 104 b. Inner facingwalls 104 a and 104 b may be etched to have any suitable configuration.The precise configuration of the inner facing walls 104 a and 104 b maybe determined by a manufacturer and subsequently entered into an etchrecipe for a given etch process. In the embodiment illustrated in FIG.2, inner facing walls 104 a and 104 b are illustrated perpendicular withrespect to the seal surface 102 b of the seal plate 102. In theembodiment illustrated in FIGS. 5A and 5B, inner facing walls 104 a and104 b are illustrated slanted or angled with respect to the seal surface102 b of the seal plate 102.

With reference to FIGS. 8-9B, in an embodiment, the photolithographicand etching processes in accordance with the method 200 of the presentdisclosure may be implemented to create selectively and/or partiallyetched areas on the seal plate 102 that are configured to provide one ormore electrical points of contact on the seal plate 102 such thatelectrosurgical energy may be provided to the seal plate 102 and/orother electrical components associated therewith. More particularly, oneor more materials may be laminated together and, subsequently,selectively and/or partially etched. The materials laminated togethermay be conductive, partially-conductive, or non-conductive. Suitablematerials may include but are not limited to stainless steel, copper,silver, and the like.

In the embodiment illustrated in FIG. 8, a portion of the seal plate 102includes layers of stainless steel 122 and copper 124 laminatedtogether. In this embodiment, the layer of copper 124 is selectivelyetched. Etching the copper 124 in this manner may be used to create oneor more etched areas 126 configured to receive one or more types ofelectrical interfaces. More particularly, an etched area 126 may beconfigured to receive integrated flex, e.g., a polyimide flex circuit128 that is configured to provide electrosurgical energy to the sealplate 102, see FIG. 9A. In this instance, one or more through holes 130may be fully etched to create electrical interconnections throughdialectic material located on the polyimide flex (FIG. 9B).Additionally, seal plate 102 may include one or more partially or fullyetched areas configured to receive a bead of solder 132 to create one ormore electrical interconnections on the seal plate 102 which may resultin electrical wiring being an integral component of the seal plate 102.In addition to the foregoing, laminating layers of material togetherand, subsequently, etching (e.g., partially or fully) one of the layersof material may be used to create heat sinks (not explicitly shown) atspecific locations on the seal plate 102.

As noted above, in certain instances the seal plates are configured tomaintain a desired gap distance. With reference to FIGS. 11A-11F, in anembodiment, the photolithographic and etching processes in accordancewith the method 200 of the present disclosure may be implemented tocreate one or more different types of insulation barriers, e.g., stopmembers, between seal plates associated with an end effector assemblyMore particularly, photolithographic and etching processes of thepresent disclosure may be implemented to create one or more partially orfully etched recesses or pockets 136 a on seal surface 102 a of the sealplate 102 (see FIG. 11A, for example), wherein the pockets 136 a isconfigured to receive one or more types of corresponding spacers 136 b(FIG. 11A). An etched recess 136 a may include an etch depth of 0.002inches. Spacer 136 b may be any suitable type of spacer known in theart. Spacer 136 may extend from seal surface 102 a a distance thatranges from about 0.005 inches to about 0.01 inches. In an embodiment,spacer 136 b may be a ceramic spacer made from aluminum titaniumcarbide, commonly referred to in the art and hereinafter referred to asAlTiC).

Etched recesses 136 a and corresponding spacers 136 b may have anysuitable geometric configuration and may be dimension to fit within a0.030×0.030 inch area (FIG. 11B). For example, FIG. 11A illustrates anetched recess 136 a and corresponding spacer 136 b each including ahemispherical configuration. FIG. 11B illustrates an etched recess 138 aand corresponding spacer 138 b each including a cylindricalconfiguration. FIG. 11C illustrates an etched recess 140 a andcorresponding spacer 140 b each including a square configuration. FIG.11D illustrates an etched recess 142 a and corresponding spacer 142 beach including a triangular configuration. FIG. 11E illustrates aplurality of etched recesses 144 a and corresponding spacers 144 b in anintermittent or staggered configuration. In embodiments, any of theaforementioned etched recesses and corresponding spacers may be arrangedin a grid like configuration, see FIG. 11F for example. The combinationof any of the aforementioned etched recesses, e.g., recess 138 a andspacers, e.g., spacer 138 b provides a user with the ability tomanipulate how the jaw members 110 and 120 come together. For example,cylindrical shaped recess 138 a and corresponding spacer 138 b may beconfigured to force one of the jaw members, e.g., a upper jaw member 110to roll along an axis of the spacer 138 b when the upper jaw member 110and a bottom jaw member 120 of an end effector assembly are moved towardeach other, which, in turn, results in a more precise alignment of theupper and lower jaw members 110 and 120, respectively.

Moreover, the combination of any of the aforementioned etched recesses,e.g., recess 136 a and spacers, e.g., spacer 136 b increases theintegrity of a bond between the seal surface 102 a and spacer 136 b inthat the spacer 136 b is encased within a recess 136 b, as opposed toonly being bonded to the seal surface 102 a of the seal plate 102. Thephotolithographic and etching processes in accordance with the method200 of the present disclosure allows a manufacturer to position any ofthe aforementioned spacers, e.g., spacer 136 b within a correspondingpocket 136 a to within a 0.0005 inch tolerance.

With reference now to FIGS. 12-13B, in an embodiment, a step of themethod 200 may include etching one or more recesses, e.g., 136 a on theseal surface 102 a of the seal plate 102 and positioning a spacer, e.g.,spacer 136 b in the recess 136 a. In this instance, an automated system300 is provided and includes a plurality of modules 400 that includes avacuum module 600, an adhesive dispensing module 700, and an optionaloptical module 800. Each of the foregoing modules is fully automated andin operative communication with a photolithography module 500(configured to provide functions previously described herein) that isalso fully automated.

Photolithography module 500 is configured to fully, partially, and/orselectively etch one or more pockets 136 b on the seal surface 102 a ofthe seal plate 102. After the pockets 136 b have been etched into theseal surface 102 a of the seal plate 102, the seal plate 102 istransferred to adhesive dispensing module 700 where a bead of adhesive702 will be dispensed into the pocket 136 b such that a spacer 136 a maybe positioned into the pocket 136 b and bonded therein.

Vacuum module 600 is configured to raise and transfer a spacer, e.g.,spacer 136 b from a loading module 900 (a loading table 900, forexample) to the one or more pockets 136 a on the seal plate 102 andlower the spacer 136 b within the pocket 136 a on the seal plate 102.With this purpose mind, the vacuum module 600 includes one or morevacuum transfer devices 602 operatively connected to a vacuum source604. Vacuum transfer device 602 may be any suitable device that iscapable of raising, transferring and lowering a spacer 136 b. Forexample, vacuum devices typically associated with the manufactureprocess of disk drives, auto slider bond, SMT automated assembly and PCBassembly may be utilized in combination with vacuum module 600. In anembodiment, the vacuum transfer device 602 (e.g., vacuum devicetypically utilized in the manufacture process PCB assembly) includes adistal end 606 configured to raise a spacer 136 b (FIG. 13) from loadingtable 900, transfer the spacer 136 b to the recess 136 a, and,subsequently, lower the spacer 136 b within the recess 136 a.

Adhesive dispensing module 700 is configured to dispense a bead ofsuitable adhesive 702 into the one or more pockets 136 a on the sealplate 102. In an embodiment, the adhesive dispensing module includes adevice 704 configured to heat cure the adhesive 702 after the spacer 136b has been positioned within the pocket 136 a.

In an embodiment, an optical module 800 is provided and is configured tomonitor the volume of adhesive 702 dispensed within the pocket 136 a,monitor alignment of the spacer 136 b with respect to pocket 136 aand/or monitor placement of the spacer 136 b within the pocket 136 a. Tothis end, optical module 800 may include one or more types of camera 802located at or near the adhesive dispensing module 700.

System 300 includes one or more microprocessors 1100 including one ormore algorithms 1200 configured to control and monitor each of theabove-referenced modules during transferring and positioning of thespacers 136 b within the pockets 136 a. System 300 employs an x-ycoordinate axis system to facilitate properly aligning a spacer 136 band pocket 136 a (FIG. 13A).

In use, the vacuum transfer device 602 of vacuum module 600 is used toraise one of a plurality of spacers 136 b from a loading table 900 to anadhesive station 1000 where the seal plate 102 is located. At a timeprior to the spacer 136 b arriving at the adhesive station 1000,adhesive dispensing module 700 dispenses a bead of adhesive 702 (FIG.13B) within a pocket 136 a. The time the bead of adhesive 702 isdispensed will depend on such parameters as type of adhesive, cure timeof adhesive, volume of adhesive, etc. Camera 802 of optical module 800may be employed to ensure that the spacer 136 b and pocket 136 a areproperly aligned. Once it is determined that the spacer 136 a and pocket136 b are properly aligned, the vacuum transfer device 602 may beemployed to lower the spacer 136 b into pocket 136 a. Camera 802 ofoptical module 800 may again be employed to ensure that the spacer 136 bseats at a proper height above pocket 136 a (FIG. 13B). In accordancewith the present disclosure spacer 136 b seats at a height above thepocket 136 a that ranges from about 0.001 inches to about 0.006 inches.Once it is determined that the spacer 136 b seats at a proper heightabove pocket 136 a, ultra violet heat may be applied to facilitate thecuring process.

From the foregoing and with reference to the various figure drawings,those skilled in the art will appreciate that certain modifications canalso be made to the present disclosure without departing from the scopeof the same.

While several embodiments of the disclosure have been shown in thedrawings, it is not intended that the disclosure be limited thereto, asit is intended that the disclosure be as broad in scope as the art willallow and that the specification be read likewise. Therefore, the abovedescription should not be construed as limiting, but merely asexemplifications of particular embodiments. Those skilled in the artwill envision other modifications within the scope and spirit of theclaims appended hereto.

1. A system for manufacturing an end effector assembly configured foruse with an electrosurgical instrument, the system comprising: aphotolithography module configured to etch at least one pocket on atleast one seal plate of the end effector assembly; a vacuum moduleconfigured to raise, transfer and lower a spacer from a location remotefrom the at least one pocket on the seal plate to each of the at leastone pocket on the seal plate; an adhesive dispensing module configuredto dispense an adhesive into the at least one pocket on the seal plate;and an optical module configured to monitor a volume of the adhesivedispensed within the at least one pocket and monitor placement of thespacer within the at least one pocket.
 2. The system according to claim1, further including a module to cure the adhesive after the spacer hasbeen positioned within each at least one pocket.
 3. The system accordingto claim 1, wherein a retention feature is etched on the at least oneseal plate and is configured to secure the at least one seal plate to atleast one of a pair of jaw members of the end effector assembly.
 4. Thesystem according to claim 1, wherein a knife slot is etched into the atleast one seal plate and is configured to receive a knife blade of theelectrosurgical instrument.
 5. The system according to claim 1, whereinthe at least one seal plate includes at least two materials laminatedtogether, wherein at least one of the two materials is electricallyconductive.
 6. The system according to claim 1, wherein the opticalmodule includes one or more types of cameras to ensure that the spacerand the at least one pocket are aligned.
 7. The system according toclaim 1, wherein the optical module includes one or more types ofcameras to ensure that the spacer is positioned at a proper heightrelative to the at least one pocket.